RHP150PLUS is the rapid thermal processing
system which can be used for processes of 6” silicon, glass, and
sapphire wafers. Our system adopted an optimized bulb type
lamp array in heater and chamber that will achieve a precise
temperature control with rotation module. And its vacuum
capability with quartz seal cup will enable to expand the
process application without quartz window.
RHP150PLUS use 6” substrates.
In case of 2” wafer process,
2” process kit will be used.(Optional)

RHP200 is the 200mm rapid thermal processing system
which can be used for leading edge processes for memory and
logic devices. Our system adopted an optimized lamp arrayed
heater block and chamber that will achieve a precise
temperature control with wafer rotation module, and emissivity
compensated pyrometers. And its vacuum capability will enable
to expand the process application. With dual chamber and
2 or 3 cassette stage configuration, it provides maximum
productivity with smallest footprint. (Stand Alone or Backbone
Configuration is available)

RHP440 is the rapid heating process system which can
be used for ITO annealing process for 2” or 4”sapphire wafers.
Our system adopted a dual lamp array heater block and
chamber that will achieve a precise temperature control .
And its vacuum capability will enable to expand the process
application by quartz tube sealing structure
(have no quartz window) With a transfer robot, aligner,
and 2 or 3 cassette stage configuration, it provides maximum
productivity with smallest footprint.

RHP620 is the rapid heating process system which
can be used for 6” Silicon wafer and 6” sapphire wafers.
Our system adopted an optimized lamp array heater block and
chamber that will achieve a precise temperature control with
wafer rotation module and advanced PID control.
And its vacuum capability will enable to expand the process
application. With a transfer robot, aligner, dual chamber and
2 or 3 cassette stage configuration, it provides maximum
productivity with smallest footprint.

RHP640AVP is rapid thermal processing system which
can be used for 6” compound semiconductor and silicon wafer.
Our fully automated system adopted an optimized lamp
arrayed heater block and rotation module that will achieve a
precise temperature control with pyrometer which can control
power ratio. To maximized temperature control and a
Multi-chamber process configuration, it provides maximum
productivity with smallest footprint.